LUNZO s.r.o. (Czechia) · info@lunzo.ie · +420 603 337 330 · Mon–Sun 8:00–17:00 Irish time · support in English · Contact Us

Home page Home page PC & Laptop Accessories PC Components CPU coolers and fans Thermal Pad Between Chip and Heat Sink 85 x 45 x 3 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting for Electronics
Thermal Pad Between Chip and Heat Sink 85 x 45 x 3 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting for Electronics

Thermal Pad Between Chip and Heat Sink 85 x 45 x 3 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting for Electronics

The 3 mm thick pad transfers heat from chips to heat sinks with a conductivity of 21 W/m.K. The grey piece measuring 85 x 45 mm can be cut and does not conduct electricity. Full description
In stock
Delivery €1.59
30-day return policy
€20.48
Safe shopping Safe shopping
Overview
Thermal Pad Between Chip and Heat Sink 85 x 45 x 3 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting for Electronics

The thermal pad between the chip and heat sink, with a thickness of 3 mm, is used in devices where there is a three-millimetre gap between the component and the heat sink. Such a space can be found in gaming consoles, laptops, graphics cards, and other electronics with passive or active cooling. Thanks to thermal conductivity of 21 W/m.K, the pad transfers heat from the component to the heat sink and eliminates the insulating layer of air. The grey piece measuring 85 x 45 x 3 mm can be precisely cut to fit the shape of individual chips using scissors. Both surfaces are covered with a blue protective film.

  • Thickness 3 mm – when selecting, it is essential to consider the gap in the specific device. It is advisable to measure the original pad with a caliper or check the specification in the service documentation to ensure the heat sink contacts all components simultaneously.
  • Dimension 85 x 45 mm – from one piece, several smaller parts for memory and power circuits can be cut out, or a larger piece for a bulkier component. The remaining material will be available for further repairs or other devices.
  • Thermal Conductivity – the value of 21 W/m.K is intended for components with higher thermal loads. The pad conforms to the surface of the chip and fills in small irregularities between it and the heat sink, preventing heat from passing through the air.
  • Non-Conductive Material – the pad does not conduct electricity, and the parameter table states breakdown voltage of at least 9.8 kV per 1 mm. It can therefore be placed directly on the populated printed circuit board.
  • Surface Protection – the blue film on both sides prevents contamination during storage and cutting. It is gradually removed during assembly, first from the side facing the chip and then from the side facing the heat sink, to prevent dust from settling on the surface.
  • Usage – gaming consoles, laptops, graphics cards, M.2 SSDs, processors, chips on motherboards, and other electronics where the manufacturer anticipates a 3 mm gap between the component and the heat sink.

Contents of the package:

  • 1x thermal pad 85 x 45 mm

The grey thermal pad 85 x 45 x 3 mm is suitable for maintenance and repairs of cooling systems when the original pads have hardened, disintegrated, or torn during disassembly of the device. The process begins with removing the heat sink, cleaning off remnants of the old material, and cleaning the chips. The pad is then cut into the required pieces, the film is removed from them, and the pieces are placed on the components where the heat sink will be reattached. Thickness 3 mm is suitable for devices where the manufacturer accounts for this gap. From the area of 85 x 45 mm, parts for memory, power circuits, and other chips in one device are prepared.

Delivery and Returns
Price incl. VAT €20.48