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Home page Home page PC & Laptop Accessories PC Components CPU coolers and fans Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 1
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 1
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 2
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 3
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 4
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 5
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler 6

Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler

Grey thermal pad 85 x 45 x 2.25 mm fills the gap under the cooler and conducts heat from the chips with a conductivity of 21 W/m.K. It does not conduct electric current. Full description
In stock
Delivery €1.59
30-day return policy
€19.61
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Overview
Thermal Pad 85 x 45 x 2.25 mm with Conductivity 21 W/m.K Grey for Cutting to Fill the Gap Between the Chip and the Cooler

The thermal pad with a thickness of 2.25 mm fills the space between the component and the cooler in places where the gap is just over two millimetres. Such a place is often found in some graphics cards, gaming consoles, and laptops, where the cooler is positioned higher above the memory or power circuits than above the main chip. The pad with thermal conductivity of 21 W/m.K replaces the air, which conducts heat very poorly, and transfers it to the cooler. The grey rectangle measuring 85 x 45 x 2.25 mm can be cut with scissors into pieces according to the size of the components. Both sides are covered with a blue film.

  • Thickness 2.25 mm – the pad is selected based on the distance between the chip and the cooler. The most reliable method is to measure the original pad or refer to the service documentation to ensure the cooler makes contact with all components simultaneously.
  • Area 85 x 45 mm – from one piece, parts for memory, power circuits, and other chips can be prepared. The remaining pieces can be kept in stock for future repairs, for example, for other devices with the same gap.
  • Conductivity 21 W/m.K – designed for components that heat up significantly under load. The pad adapts to the surface of the chip and fills its minor irregularities and height differences between adjacent components.
  • Insulating Material – the pad does not conduct electric current, and the parameter table indicates breakdown voltage of at least 9.8 kV per 1 mm. It is therefore suitable for boards with densely populated components, where the pad may extend over neighbouring parts.
  • Protective Film on Both Sides – protects the cleanliness of the surface during storage and cutting. It is gradually removed only during assembly, first from the side facing the chip and finally from the side facing the cooler, to prevent the surface from becoming contaminated with dust.
  • Usage – graphics cards, gaming consoles, laptops, M.2 SSDs, processors, and chipset motherboards, if the manufacturer accounts for a gap of 2.25 mm between the component and the cooler.

Contents of the Package:

  • 1x thermal pad 85 x 45 mm

The grey thermal pad 85 x 45 x 2.25 mm is intended for repairs and maintenance of cooling systems, where it is necessary to replace hardened, crumbled, or torn pads. After removing the cooler, any remnants of the old material are removed, and the surfaces of the components are cleaned. The pad is cut into pieces, the film is removed from each, and the pieces are placed on the chips, after which the cooler is reattached. Thickness 2.25 mm corresponds to devices where the manufacturer accounts for this gap. From the area of 85 x 45 mm, pieces are prepared for memory and power circuits as well as for other components.

Delivery and Returns
Price incl. VAT €19.61