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Home page Home page PC & Laptop Accessories PC Components CPU coolers and fans Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 1
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 1
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 2
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 3
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 4
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 5
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards 6

Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards

Pad 85 x 45 mm with a thickness of 1.5 mm and conductivity of 21 W/m.K for memory and power of the graphics card. It does not conduct electricity and can be cut to the required sizes. Full description
In stock
Delivery €1.59
30-day return policy
€18.30
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Overview
Thermal Conductive Pad for Heatsink 85 x 45 x 1.5 mm 21 W/m.K Grey Non-Conductive for Memory and Power of Graphics Cards

The thermal conductive pad for heatsink with a thickness of 1.5 mm bridges the gap of one and a half millimetres between the chip and the heatsink. Such a distance is typical for memory chips and power circuits of graphics cards, but it also appears in laptops and gaming consoles. The material with thermal conductivity of 21 W/m.K transfers heat from the components to the heatsink, which then dissipates it into the surroundings. The grey pad measures 85 x 45 x 1.5 mm and can be cut into pieces according to the size of the chips using scissors. Both sides are covered with a blue protective film.

  • Thickness 1.5 mm – the pad must match the gap in the given device. The safest method is to measure the original pad with a calliper, or to refer to the service documentation from the graphics card or laptop manufacturer.
  • Large Area – the format 85 x 45 mm allows for cutting multiple pieces for memory placed around the core of the graphics card as well as for the transistors of the power cascade. The remaining pieces are useful for other repairs or in another device with the same gap.
  • Heat Transfer – conductivity of 21 W/m.K is suitable for components with high thermal loads. The pad also compensates for the different heights of neighbouring chips and minor surface irregularities, ensuring that no air remains between the chip and the heatsink.
  • Electrical Insulation – the material does not conduct electricity and according to the parameter table has dielectric strength of at least 9.8 kV per 1 mm. Therefore, it can be placed directly on the mounted components, even if the pad slightly overhangs neighbouring parts.
  • Blue Protective Films – protect the surface of the pad from dust during storage and cutting. The bottom film is removed before applying it to the chip, and the top one just before fitting the heatsink to prevent contamination of the surface.
  • Usage – graphics cards, laptops, gaming consoles, M.2 SSD drives, processors, and chipsets on motherboards, where the manufacturer accounts for a gap of 1.5 mm between the component and the heatsink.

Contents of the Package:

  • 1x thermal conductive pad 85 x 45 mm

The grey pad 85 x 45 x 1.5 mm is intended for replacing old pads during cooling maintenance, when the original material has dried out, hardened, or torn when removing the heatsink. After disassembly, remnants of the old pad are removed and the chips are cleaned. Subsequently, the pad is cut into the required pieces, the film is removed from them, and the pieces are applied to the components where the heatsink will be reattached. Thickness 1.5 mm corresponds to devices where the manufacturer accounts for this gap. From the area of 85 x 45 mm, parts are prepared for memory and power of the graphics card as well as for other smaller chips.

Delivery and Returns
Price incl. VAT €18.30