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Home page Home page PC & Laptop Accessories PC Components CPU coolers and fans Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 1
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 1
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 2
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 3
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 4
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 5
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips 6

Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips

Thermal conductive pad with a thickness of 2.5 mm and conductivity of 21 W/m.K. Grey pad can be cut to fit memory and power circuits of graphics cards or consoles. Full description
In stock
Delivery €1.59
30-day return policy
€17.86
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Overview
Thermal Conductive Pad 120 x 20 x 2.5 mm with Conductivity 21 W/m.K Grey Non-Conductive for Cutting to Size for Graphics Card and Console Chips

The thermal conductive pad with a thickness of 2.5 mm is designed to fill the gap between the component and the heatsink, which reaches two and a half millimetres. Such a distance can be found in some graphics cards, gaming consoles, or laptops, where the heatsink sits higher than the main chip over the memory or power supply. The material with thermal conductivity of 21 W/m.K transfers heat from the components to the heatsink, which then dissipates it into the environment. The pad measures 120 x 20 x 2.5 mm and can be cut into pieces as needed with scissors. Both surfaces are covered with a blue film.

  • Thickness 2.5 mm – the thickness is selected according to the gap in the specific device. It can be determined by measuring the original pad after disassembly or by information from the service manual to ensure the heatsink properly contacts all components.
  • Effective Heat Transfer – conductivity of 21 W/m.K is suitable for components with high thermal loads, such as GDDR memory, power transistors, or SSD controllers. The pad also fills small irregularities on the surface of the chips, preventing heat from passing through the air.
  • Non-Conductive – the material is electrically non-conductive, and the specification table indicates breakdown voltage of at least 9.8 kV per 1 mm. Therefore, the pad can rest directly on the components mounted on the printed circuit board.
  • Cutting to Size – rectangles corresponding to the dimensions of individual components can be cut from the 120 x 20 mm pad. A longer continuous strip can also be used for several memory chips side by side. The remaining material can be stored for future repairs.
  • Protective Films – the blue films protect the surface from dust and facilitate cutting. They are removed only during the actual assembly to prevent any dirt from getting between the pad and the component or heatsink.
  • Applications – graphics cards, gaming consoles, laptops, M.2 SSDs, processors, and chips on motherboards where the manufacturer anticipates a 2.5 mm gap between the component and the heatsink.

Contents of the package:

  • 1x thermal conductive pad 120 x 20 mm

The grey thermal conductive pad 120 x 20 x 2.5 mm is intended for repairs and maintenance of cooling systems where it is necessary to replace hardened, crumbled, or torn pads. After removing the heatsink, any remnants of the old material are removed from the chips and the surface is cleaned. The pad is then cut into the required pieces, the films are removed, and the pieces are placed on the components, onto which the heatsink is finally reattached. Thickness 2.5 mm corresponds to devices for which the manufacturer anticipates this gap. One pad can cover multiple components, such as memory chips and power supply of the graphics card.

Delivery and Returns
Price incl. VAT €17.86