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Hot Air Repair Station 1300 W with Temperature 100–550 °C and Flow Rate 1–200 l/min with 3 Modes and Display in Grey for BGA Repairs

Hot Air Repair Station 1300 W with Temperature 100–550 °C and Flow Rate 1–200 l/min with 3 Modes and Display in Grey for BGA Repairs

Power of 1300 W and hot air up to 550 °C can handle the removal of BGA chips and larger components. The set includes nine nozzles, two heating elements, and a separate stand. Full description
In stock
Delivery €1.59
30-day return policy
€695.59
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Overview
Hot Air Repair Station 1300 W with Temperature 100–550 °C and Flow Rate 1–200 l/min with 3 Modes and Display in Grey for BGA Repairs

The hot air repair station with a maximum power of 1300 W is designed for demanding repairs of printed circuit boards, the removal and installation of BGA chips, as well as working with other SMD components. The temperature of the hot air can be set in the range of 100–550 °C and the air flow rate between 1–200 l/min, allowing for a gentle flow for small parts and a strong flow for large areas. The station offers three operating modes, which can be switched using the MODE button on the front panel. The set values and four saved presets are clearly displayed on the wide digital display. The grey metal body is complemented by a separate stand for the hot air gun, a set of nine nozzles, and two interchangeable heating elements.

  • Power 1300 W and Supply Voltage 220 V – High power allows for rapid heating of large components and extensive areas of the board. The station connects to a standard 220 V AC network and is turned on with the POWER switch on the front panel.
  • Temperature and Flow Control – The air temperature is adjustable in the range of 100–550 °C, and the air flow rate ranges from 1–200 l/min. The combination of both values allows for the heating to be tailored to the size and sensitivity of each component being repaired.
  • Display with Four Presets – The current temperature and air volume are displayed at the top of the screen, with four saved combinations of temperature and flow rate below. The CH1 to CH4 buttons allow for immediate recall of saved settings without the need to re-enter values.
  • Additional Functions on the Panel – The control panel features buttons for sound signalling, switching between °C and °F, cold air, and calibration. The cold air function is useful for cooling the repaired area after completing work.
  • Nine Interchangeable Nozzles – The set includes four straight nozzles of varying diameters, three bent nozzles for hard-to-reach places, and two square nozzles for even heating of square housings. By selecting a nozzle, the air flow can be directed precisely to the component being repaired.
  • Heating Elements 7B and 11A – The package includes two interchangeable heating elements marked 7B and 11A, which expand the usability of the hot air gun.
  • Stand and Grounding Wire – The separate stand securely holds the hot air gun between work steps. The grounding wire is used to connect the station to the grounding of the workstation.

Contents of the Package:

  • 1x hot air repair station
  • 1x stand for hot air gun
  • 1x heating element 7B
  • 1x heating element 11A
  • 4x straight nozzle
  • 3x bent nozzle
  • 2x square nozzle
  • 1x grounding wire

The hot air station with a power of 1300 W is suitable for electronics service centres, mobile phone repair shops, and workshops that regularly work with chips and SMD components. The wide range of temperature and air flow allows for suitable settings for both small and large components. Thanks to nine nozzles of different shapes, the flow of hot air can be adapted to almost any type of housing. Four memory presets and a clear display facilitate repeated work with the same settings. The assembly is a practical choice for anyone needing powerful equipment for BGA chip and printed circuit board repairs.

Delivery and Returns
Price incl. VAT €695.59