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Thermal Conductive Silicone Paste GD007 30 g in a Jar with Screw Cap Density 2.5 g/cm³ Grey For CPU Coolers IGBT Modules and Inverters

Thermal Conductive Silicone Paste GD007 30 g in a Jar with Screw Cap Density 2.5 g/cm³ Grey For CPU Coolers IGBT Modules and Inverters

Jar containing 30 g of GD007 silicone paste for application with a spatula on large areas of coolers, IGBT modules, inverters, and UPS sources as well as on computer processors. Full description
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€22.66
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Overview
Thermal Conductive Silicone Paste GD007 30 g in a Jar with Screw Cap Density 2.5 g/cm³ Grey For CPU Coolers IGBT Modules and Inverters

The GD007 thermal conductive paste fills microscopic irregularities between the surface of the component and the cooler base, allowing heat to transfer to the cooler smoothly and without air pockets. This version is supplied in a plastic jar containing 30 g, from which it can be easily scooped and spread over a large area. It is a grey silicone thermal conductive grease GD007 that creates a thin and continuous layer. The jar is particularly suitable for workshops and service centres where large power electronics coolers are used and the paste is consumed in larger quantities. It is applicable for inverters, power supplies, servers, and computers.

The density of the paste stated on the label is 2.5 g/cm³, and thanks to its grey colour, you can easily see if the contact surface is fully covered. The jar has an orange label marked GD007 and a black screw cap that protects the contents from dust and drying out when closed. The wide neck allows for easy scooping of the paste with a spatula, which is faster and more convenient for large areas than squeezing from a syringe. The paste is intended for IGBT modules and inverter coolers, but it also works well for CPU processors, computer water cooling, UPS power supplies, servers, or for cooling electronics in cars and household appliances.

  • Type – silicone thermal conductive paste GD007
  • Quantity of paste – 30 g
  • Packaging – plastic jar with a black screw cap
  • Density – 2.5 g/cm³
  • Paste colour – grey
  • Usage – IGBT modules, inverters, UPS power supplies, servers, CPU processors, coolers, water cooling, and electronics in cars
  • Contents of the package – 1 jar with 30 g of GD007 thermal conductive paste

Before application, remove any residues of old paste from the contact surfaces and clean the surface with isopropyl alcohol and a lint-free cloth. Scoop the paste from the jar with a clean spatula or flat blade and spread it in a thin layer across the entire surface of the component; for the processor, a small amount in the centre of the chip will suffice, which will be spread by the pressure of the cooler. A thicker layer will not improve cooling, so use less paste and wipe away any excess. Do not return any applied paste to the jar to avoid contamination of the supply. After use, securely screw on the cap and store the jar in a dry, cool place out of reach of children.

The GD007 thermal conductive paste in a jar is a practical supply for service, workshops, and maintenance of industrial equipment. The 30 g content is sufficient for many paste replacements on processors as well as on large coolers for power electronics. The silicone composition and grey colour facilitate spreading and checking the layer. The screw cap keeps the remaining paste clean for the next use. In the package, you will find a jar with 30 g of GD007 paste ready for immediate use.

Price incl. VAT €22.66