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Silicone Thermal Conductive Paste GD007 15 g in a Large Syringe Density 2.5 g/cm³ Grey For CPU Processors IGBT Modules and Inverters

Silicone Thermal Conductive Paste GD007 15 g in a Large Syringe Density 2.5 g/cm³ Grey For CPU Processors IGBT Modules and Inverters

Large syringe containing 15 g of GD007 paste as a supply for servicing desktop computers and servers as well as for cooling power electronics, IGBT modules and inverters. Full description
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€18.73
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Overview
Silicone Thermal Conductive Paste GD007 15 g in a Large Syringe Density 2.5 g/cm³ Grey For CPU Processors IGBT Modules and Inverters

The GD007 thermal conductive paste fills microscopic cavities between the chip surface and the heatsink base, allowing heat from the power component to transfer to the heatsink smoothly and without air gaps. It is filled in a large syringe containing 15 g, from which you can dispense exactly the amount of paste you need. This is GD007 silicone thermal conductive grease in grey colour, which you can easily spread into a thin layer. Fifteen grams is a supply that will be useful for service technicians, computer lab managers, and DIY enthusiasts who regularly repair electronics. The paste is suitable for use in computers, servers, inverters, and in industrial devices with power components.

The density of the paste indicated on the label is 2.5 g/cm³ and the grey colour makes it easy to check whether the contact surface is fully covered. The syringe has a gold label marked GD007 and the nozzle is covered with a blue cap, preventing the paste from drying out between uses. The larger volume allows for convenient treatment of larger bases of power electronics heatsinks, where a small syringe would quickly run out. The paste is suitable for IGBT modules and inverter heatsinks, but it also works well with CPU processors, computer water cooling, UPS power supplies, servers, or for cooling electronics in cars and household appliances.

  • Type – GD007 silicone thermal conductive paste
  • Amount of paste – 15 g
  • Packaging – large syringe with a blue nozzle cap
  • Density – 2.5 g/cm³
  • Paste colour – grey
  • Usage – IGBT modules, inverters, CPU processors, heatsinks, servers, water cooling, UPS power supplies and electronics in cars
  • Contents – 1 syringe with 15 g of GD007 thermal conductive paste

Before application, remove the old paste and clean both contact surfaces with isopropyl alcohol and a lint-free cloth to ensure no dust or grease remains. For the processor, simply squeeze a small drop onto the centre of the chip, and the pressure from the heatsink will spread it out. For IGBT modules and inverter heatsinks, apply the paste in a thin continuous layer across the entire surface, and only then tighten the components. A thicker layer will not improve heat dissipation, so always wipe away any excess around the component. After use, replace the cap on the nozzle and store the syringe in a dry and cool place out of reach of children.

The GD007 thermal conductive paste in a large syringe is a practical supply for workshops, servicing, and maintenance of server rooms. The 15 g content is sufficient for many paste replacements on processors and power electronics heatsinks. The silicone composition and grey colour facilitate application and layer inspection. Dispensing from the syringe is clean and precise, allowing you to apply only as much paste as the component truly needs. In the packaging, you will find a syringe with 15 g of GD007 paste ready for immediate use.

Price incl. VAT €18.73