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Mobile Cooling Plate for Back Clip Coolers Shape L 106 x 60 mm Thermal Conductive Silicone Layer Black For Gaming

Mobile Cooling Plate for Back Clip Coolers Shape L 106 x 60 mm Thermal Conductive Silicone Layer Black For Gaming

Self-adhesive cooling plate for the back of the phone increases the area for heat dissipation. An ideal accessory for the clip-on semiconductor cooler during gaming. Full description
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€21.79
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Overview
Mobile Cooling Plate for Back Clip Coolers Shape L 106 x 60 mm Thermal Conductive Silicone Layer Black For Gaming

The mobile cooling plate is designed for owners of semiconductor coolers that attach to the phone using a back clip. The plate adheres to the back of the phone and increases the area through which heat from the hottest spots is dissipated to the cooler. It has an L shape with dimensions of 106 x 60 mm, covering the area of the processor and camera. The underside features a thermal conductive silicone layer, which connects the plate to the back of the phone and aids in heat transfer. It is suitable for gamers, streamers, and anyone whose phone overheats during intensive use.

The purpose of the plate is to distribute heat from the hot spots of the phone evenly over a larger area, from which the back clip cooler can more easily extract it. The top layer utilises the thermal conductivity of aluminium and effectively transfers heat towards the cooler. The plate is very thin, so the phone does not feel bulkier in hand and does not alter its grip. The narrow part of the L shape has a width of 28 mm and runs along the top edge of the back, where the processor is typically located. The surface is black with white graphics in a gaming style, making the plate on the back of the phone look like a decorative sticker.

  • Type – cooling plate for phone coolers with a back clip
  • Shape – letter L
  • Dimensions – 106 x 60 mm, width of narrow part 28 mm
  • Underside – thermal conductive silicone layer
  • Top Side – black with white graphics
  • Usage – with semiconductor cooler with a back clip
  • Compatibility – iPhone, Samsung, Xiaomi phones and others
  • Fan – not included
  • Package Contents – 1 cooling plate without cooler

Before applying, wipe the back of the phone dry and remove dust and grease. Position the plate so that the circular part lies where the phone heats up the most, and press it firmly. Then attach the back clip cooler so that its cooling surface rests on the circular part of the plate. The plate is intended directly for the back of the phone, not for a case, as a case would limit heat transfer. The graphics on the top side also serve as a guide for where to place the cooler. The cooling fan and other accessories are not included; the plate is purchased as an accessory for the cooler you already have.

The L-shaped cooling plate increases the area for heat dissipation from the phone and helps the back clip cooler work more effectively. With dimensions of 106 x 60 mm, it covers the area of the processor and camera, and due to its thin design, it does not obstruct in hand. The silicone thermal conductive layer ensures good heat transfer from the back of the phone to the plate. It is designed for semiconductor coolers with a back clip and is suitable for long gaming sessions, streaming, and video recording. It is an inexpensive accessory that maximises the performance of the cooler you are already using.

Price incl. VAT €21.79