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Home page Home page Hobbies & Garden Tools Soldering Irons & Accessories Lanrui K9 Soldering Paste 15 ml Thixotropic Melting Point 161 °C Needle Tip Purple Tube For Disassembling Components and Repairing PCB Boards
Lanrui K9 Soldering Paste 15 ml Thixotropic Melting Point 161 °C Needle Tip Purple Tube For Disassembling Components and Repairing PCB Boards

Lanrui K9 Soldering Paste 15 ml Thixotropic Melting Point 161 °C Needle Tip Purple Tube For Disassembling Components and Repairing PCB Boards

Low melting point of 161 °C reduces the temperature during disassembly and protects the board. Thixotropic paste stays in place and the needle dispenses it precisely between the component leads. Full description
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€27.03
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Overview
Lanrui K9 Soldering Paste 15 ml Thixotropic Melting Point 161 °C Needle Tip Purple Tube For Disassembling Components and Repairing PCB Boards

Soldering paste facilitates the disassembly of components from printed circuit boards by mixing the original solder with a low-melting alloy, thereby reducing the temperature at which the joint remains liquid. The melting point of the paste is 161 °C, allowing the component to be removed at a significantly lower temperature than standard lead-free solder, resulting in less damage to the board and surrounding components. The tube contains 15 ml of paste, which, when dispensed in small amounts, is sufficient for a large number of repairs. The thixotropic consistency means that the paste stays in place and does not run across the board when heated. The purple tube has its own needle tip, so there is no need for a separate syringe.

  • Low working temperature — by reducing the melting temperature, the risk of pad lifting and board burning during prolonged heating is decreased.
  • Thixotropic consistency — the paste stays exactly where you apply it and does not run between adjacent leads.
  • Needle tip — the integrated needle with a cap allows for precise dispensing of the paste between densely populated components without spillage.
  • Connector disassembly — ideal for removing sockets, connectors, and battery holders where there are many leads at once.
  • Repairing oxidised areas — the paste can also be used to restore oxidised solder joints.
  • Wire jumpers — facilitates soldering wire jumpers onto the repaired board.
  • Cleaning pads — after disassembly, it helps remove residual solder from the pads of the motherboard.
  • Contents — 1x tube of soldering paste 15 ml

The paste will be useful for repair technicians of mobile phones, laptops, and service technicians who disassemble multi-pin components. The usual procedure is to apply the paste to all leads at once, heat it with a tip or hot air, and the component is lifted out while the joint remains liquid. Residues of the low-melting alloy must be removed from the pads after disassembly, as they would otherwise lower the melting point even for newly soldered joints. A desoldering braid along with standard flux can be used for removal. It is recommended to ventilate the area while working and to close the tube with the cap after use.

Price incl. VAT €27.03