Solder Paste 30 g for PCB Chip Connections Yellow Colour Rosin-Based Flux High Conductivity Smooth Surface Without Oxidation
The 30 g solder paste is a high-quality rosin-based flux with excellent conductivity and very good properties for joining fine electronics. It has a yellow buttery consistency that is easy to apply to chip connections, printed circuit boards, and other precise components. Ideal for mobile phones, PC boards, or chips.
The paste supports smoother connections without residues, removes oxides through the reduction reaction of rosin, and simultaneously prevents new oxidation by creating a protective film. It reduces surface tension, thereby improving the fluidity of the solder, which facilitates the creation of a strong and clean joint.
- Product Type: solder flux
- Content: 30 g
- Consistency: buttery paste
- Colour: yellow
- Composition: rosin
- Application: chip connections, PCBs, mobile phones, fine electronics
- Function: oxidation removal, corrosion protection, support for solder fluidity
- Storage: in a cool and dark place, shelf life 12 months
- Package Contents: 1× solder paste 30 g
Instructions for Use:
- Apply a small amount of paste to the soldering area.
- Place the solder and heat with the soldering iron tip.
- The paste will melt and create a clean and shiny joint.
- No cleaning is necessary after cooling, it leaves no residues.
Key Benefits:
- Suitable for chips and fine connections
- Removes oxidation and protects against further
- Ensures smooth and conductive connections
- Increases solder fluidity for better results
- Easy application without residues
This solder paste is designed for precision work with electronics, where reliability, cleanliness, and joint strength are important. It allows for quick and quality soldering without complications. Due to its composition, it is ideal for service technicians, DIY enthusiasts, and professionals.